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PBGA (Plastic Ball Grid Array) substrate provides the interconnection platform with the circuit board for assembly package. It protects and supports ICs through thermal enhancement.
The design and advanced features of ASE's PBGAs improve the performance of graphic ICs, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays, and memory packages.
PBGA is suitable for high power and high speed ICs, requiring superb electrical and thermal enhancement.
• 15x15 mm to 45x45 mm package
• 119 balls to 1520 ball count
• High interconnect density
• Low assembly cost
• Ease of thermal and electrical management
• Ease of routing
• Good power dissipation
• Lead free /Halogen free available
• Full in-house design capability
• Fine pitch design capability
• Stub-less design capability
• Build up structure capability
Package Level
Regular
BOM
(240°C) |
MSL |
JEDEC Level 3, 30°C/60% RH |
192 hours |
| PCT |
121°C/100%RH/15 psig |
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| TCT |
-65°C~150°C |
100 cycles |
| HAST |
130°C/85%RH/33.5 psig |
96 hours |
| HTST |
150°C |
1000 hours |
Lead Free
BOM
(260°C) |
MSL |
JEDEC Level 3, 30°C/60% RH |
192 hours |
| TCT |
-65°C~150°C |
100 cycles |
| HAST |
130°C/85%RH/33.5 psig |
96 hours |
| HTST |
150°C |
1000 hours |
Lead Free
BOM
(260°C) |
MSL |
JEDEC Level 2, 85°C/60% RH |
168 hours |
| TCT |
-65°C~150°C |
100 cycles |
| HAST |
130°C/85%RH/33.5 psig |
96 hours |
| HTST |
150°C |
1000 hours |
Stand Materials
| Category |
Item |
Available Solution |
| Material |
Core /LeadFree |
BT HL832, HL832HS |
| Core Halogen Free |
HL832NB , HL832NX, E679FGB(for 2L) |
| Solder Mask |
AUS 5 |
| Solder Mask /Lead Free |
AUS 5 ,AUS303 |
| Solder Mask /Halogen Free |
AUS 308 |
| Solder Mask /High Reliability |
Remark |
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