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GPP refers to Gold Plating Process, meaning that the Ni/Au plating process has been applied to all trace and finger patterns.
ASE BGA's design and features improve the performance of graphic ICs, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays and memory packages.
What is so unique about the GPP design is that it has no plating bus, which results in the following:
• Better electrical performance in high-frequency.
• Higher density in substrate pattern design.
• Open/Short Test can be applied in substrate suppliers for matrix substrate type.
Package Level
Regular
BOM
(240°C) |
MSL |
JEDEC Level 3, 30°C/60% RH |
192 hours |
| PCT |
121°C/100%RH/15 psig |
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| TCT |
-65°C~150°C |
100 cycles |
| HAST |
130°C/85%RH/33.5 psig |
96 hours |
| HTST |
150°C |
1000 hours |
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