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Flip Chip Organic BGA
Organic BGA Laminate or build-up organic substrate offers better electrical performance than wire-bond BGA packages, especially in high frequency applications.
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Computers: Graphics/chipsets for PC, Server and High-end applications, Microprocessors for PC & Server, and Memory. |
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Telecommunications: Network products (LAN), Switching, Transmission, and Cellular Base Stations. |
Small size
Smaller IC footprint, reduced height, and weight.
Improved performance
Short interconnect delivers low inductance, resistance and capacitance, small electrical delays, good high frequency characteristics.
Increased functionality
The use of flip chips allows an increase in the number of I/Os. An area array pad layout enables more signal, power, and ground connections in less space.
Low cost
Cost of bumping decreases, as well as cost reductions in the underfill-process.
Package Level
| Pass |
| Cutomer |
Structure |
Body Size |
Die Size |
Pre-con |
PCT |
TCT |
HAST |
HTST |
THT |
| ChipSet |
2+2+2 |
37.5*37.5 |
9.5*9.5 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
150°C |
N/A |
| Pass |
1000X |
100hrs |
1000hrs |
Test
Vehicle |
2+2+2 |
40*40 |
15.3*15.3 |
125~-65°C |
121°C/
100%RH |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
| Pass |
96hrs |
1000X |
100hrs |
1000hrs |
1000hrs |
| Graphic |
2+2+2 |
40*40 |
14.5*14.5 |
150~-55°C |
121°C/
100%RH |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
| Pass |
96hrs |
1000X |
100hrs |
1000hrs |
1000hrs |
| Graphic |
2+2+2 |
40*40 |
14.5*14.5 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
220°C
Reflow Pass |
1000X |
100hrs |
1000hrs |
1000hrs |
| Graphic |
2+2+2 |
40*40 |
14.5*14.5 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
260°C
Reflow Pass |
1000X |
100hrs |
1000hrs |
1000hrs |
| Graphic |
2+2+2 |
31*31 |
9.7*9.8 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
220°C
Reflow Pass |
1000X |
100hrs |
1000hrs |
1000hrs |
| Graphic |
2+2+2 |
31*31 |
9.7*9.8 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
260°C
Reflow Pass |
1000X |
100hrs |
1000hrs |
1000hrs |
| Graphic |
2+2+2 |
40*40 |
14.5*14.5 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
| Pass |
1000X |
100hrs |
1000hrs |
100hrs |
| Graphic |
3+2+3 |
31*31 |
10.92*10.85 |
125~-55°C |
N/A |
125~-40°C |
130°C/
85%RH |
150°C |
N/A |
| Pass |
1000X |
100hrs |
1000hrs |
| Graphic |
2+2+2 |
35*35 |
12*12 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
N/A |
N/A |
| Pass |
1000X |
168hrs |
| ASIC |
1+2+1 |
35*35 |
9.93*6.17 |
150~-65°C |
121°C/
100%RH |
150~-65°C |
130°C/
100%RH |
150°C |
N/A |
| Pass |
300X |
500X |
96hrs |
1000hrs |
| Pass |
| Cutomer |
Structure |
Body Size |
Die Size |
Pre-con |
PCT |
TCT |
HAST |
HTST |
THT |
| Graphic |
2+2+2 |
37.5*37.5 |
14.86*14.86 |
150~-55°C |
N/A |
125~-55°C |
130°C/
100%RH |
150°C |
N/A |
| Pass |
1000X |
168hrs finish.
2/45 open due to crack between UBM & solder ball |
1000hrs |
| Graphic |
2+2+2 |
37.5*37.5 |
14.86*14.86 |
150~-65°C |
N/A |
125~-55°C |
130°C/
100%RH |
150°C |
N/A |
| Pass |
1000X on
going 1/45
open Metal
layer peeling |
168hrs |
1000hrs |
| ASIC |
2+2+2 |
35*35 |
7.55*7.55 |
150~-65°C |
N/A |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
| Pass |
500X |
96hrs |
1000hrs |
1000hrs |
| Graphic |
2+2+2 |
31*31 |
9.7*9.8 |
125~-55°C |
N/A |
150~-65°C |
130°C/
85%RH |
N/A |
85°C/
85%RH |
| 192hrs Pass |
500X,1/45
open due to
bump crack
1000X,2/44 open due to bump crack |
100hrs,1/45 open due to
bump crack
200hrs,6/39 open due to bump crack |
1000hrs |
| 2+2+2 |
31*31 |
9.7*9.8 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
N/A |
85°C/
85%RH |
| 96hrs Pass |
300X,1/45
open due to bump
crack 1000X,1/44
open hypothsis same defent mode a TCT & HAST FA result |
200hrs |
1000hrs |
| CSP |
2L |
13*13 |
7.7*7.7 |
150~-65°C
220°C |
N/A |
125~-55°C |
130°C/
100%RH |
|
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| Pass |
500X,11/22
die discolor
1000X stop |
96hrs,22/22
die discolor
168hrs stop |
| ASIC |
1+2+1 |
15*15 |
7.7*5.4 |
150~-65°C
220°C |
N/A |
125~-55°C |
130°C/
100%RH |
150°C |
85°C/
85%RH |
| Pass |
500X |
96hrs |
1000hrs |
1000hrs |
| Pass |
| Cutomer |
Structure |
Body Size |
Die Size |
Pre-con |
PCT |
TCT |
HAST |
HTST |
THT |
| ASIC |
2+2+2 |
35*35 |
7.55*7.55 |
150~-65°C
220°C |
N/A |
125~-55°C |
130°C/
100%RH |
150°C |
85°C/
85%RH |
| Pass |
500X |
96hrs |
1000hrs |
1000hrs |
150~-65°C
220°C |
N/A |
125~-55°C |
130°C/
100%RH |
150°C |
85°C/
85%RH |
| Pass |
500X |
96hrs |
1000hrs |
1000hrs |
| 150~-65°C |
N/A |
125~-55°C |
130°C/
100%RH |
150°C |
85°C/
85%RH |
| Pass |
500X |
96hrs |
1000hrs |
1000hrs |
| CSP |
2+2+2 |
31*31 |
15.96*16.04 |
150~-65°C |
N/A |
125~-55°C |
130°C/
100%RH |
N/A |
N/A |
| Pass |
1000X |
168hrs |
| Graphic |
2+2+2 |
31*31 |
9.14*9.14 |
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
150°C |
85°C/
85%RH |
| 1/151 open due tj missing pre-solder |
1000X |
100hrs |
1000hrs |
1000hrs |
| Graphic |
2+2+2 |
40*40 |
|
125~-55°C |
N/A |
125~-55°C |
130°C/
85%RH |
N/A |
N/A |
| 10151 short due to die short |
1000X |
100hrs |
| CPU |
2+2+2 |
37.5*37.5 |
6.45*8.66 |
150~-65°C |
N/A |
125~-55°C |
130°C/
85%RH |
N/A |
N/A |
| Pass |
1000X |
96hrs, T/S fail due to die delam. |
| Graphic |
2+2+2 |
33*33 |
12.8*12.96 |
L5 125~-55°C |
N/A |
N/A |
130°C/
85%RH |
N/A |
N/A |
| Pass |
100hrs |
| Graphic |
2+2+2 |
31*31 |
9.49*8.7 |
L5 125~-55°C |
N/A |
N/A |
130°C/
85%RH |
N/A |
N/A |
| Pass |
100hrs |
| Graphic |
2+2+2 |
31*35 |
|
125~-55°C |
N/A |
125~-55°C |
130°C/
100%RH |
150°C |
85°C/
85%RH |
| Pass |
1000X |
100hrs |
1000hrs |
500hrs |
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