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Board on Chip (BOC)
The BOC package was designed as a cost-effective CSP solution specifically for high-frequency memory devices. The structure provides the shortest wire length and outstanding electrical performance for the central-pad device layout through the use of low-cost wire bonding and BGA technologies.
The BOC package is an ideal IC package for devices such as SDRAM, SGRAM, DDR SDRAM, RAMBUS DRAM and next-generation memory products.
• Cost competitive for high performance DRAM
• JEDEC standard configuration - 60 balls
• Package dimension 1.2mm max thickness
• Dielectric - Rigid 2-layer substrate
• S/M, Rmask™ options are available
• ChipMOS's SOC packaging provides:
» 8x11mm, 8x13/8x16mm, 11x13mm body sizes
» Die-down structure
• Thin core substrate material (BT)
» Low profile (1.2mm max. total thickness)
» Low stress die attach adhesive
» Ball pitch range from 0.75 to 1.0mmCustomer substrate design available
• Customer substrate design available
Package Level
| MSL |
JEDEC Level 3, 30°C/60% RH |
192 hours |
| PCT |
121°C/100% RH/2 atm |
168 hours |
| TCT |
-65°C~150°C |
1000 cycles |
| HAST |
130°C/85%RH/33.5 PSIA |
96 hours |
| HTST |
150°C |
1000 hours |
Stand Materials
| Category |
Items |
Available Solutions |
| Material |
Core/Leadfree |
BT HL832, HL832HS |
| Core Halogen Free |
HL832NX, E679FGB |
| Solder Mask |
AUS5 |
| Solder Mask/Leadfree |
AUS5, AUS303 |
| Solder Mask/Halogen free |
AUS308 |
| Solder Mask/High Reliability |
Rmask |
| Die attach adhesive |
Tape |
| Bonding wires |
Gold |
| Solder balls |
Eutectic 63/37 Sn/Pb |
| Encapsulant |
Liquid compound |
Structure
| Single Layer Structure |
2 Layer Structure |
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Drilling Process
| Mark |
Items |
Normal |
Advance |
Remark |
| A |
Minimum hole dimension (mm) |
0.1 ~ 0.3 |
0.1 ~ 0.3 |
Tolerance: +/- 15um |
| B |
Annular ring (um) |
75 |
60 |
|
| C |
Pilot hole dimension tolerance (um) |
+/- 50 |
+/- 25 |
|
| D |
Hole to hole distance tolerance (um) |
+/- 50 |
+/- 50 |
|
| E |
Oval hole width tolerance (um) |
+/- 50 |
+/- 50 |
Dog bone |
| F |
Oval hole length tolerance (um) |
+/- 100 |
+/- 50 |
|
| G |
Land to land space (um) |
30 um |
30 um |
|
Solder Resist Opening
| Mark |
Items |
Normal |
Advance |
Remark |
| A |
SM opening registration (um) |
+/- 50 |
+/- 30 |
|
| B |
Distance of SM to pattern (um) |
+/- 50 |
+/- 30 |
|
| C |
Minimum print width (um) |
130 |
120 |
|
| D |
Minimum ball opening dia. (um) |
250 |
230 |
|
| E |
Solder resist (um) |
50 |
30 |
|
| F |
Ball land to via hole (um) |
100 |
75 |
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SM thickness (uniformity) |
+/- 15 um |
+/- 10 um |
Above Cu |
Bond Channel Design Rule
| Mark |
Items |
Normal |
Advance |
Remark |
| A |
Finger tip to slot edge (um) |
+/- 100 |
+/- 75 |
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| B, C |
Bond channel width/length |
+/- 75 |
+/- 50 |
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| D, E |
Slot center to pilot hole (um) |
+/- 75 |
+/- 50 |
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Metal burr (um) |
50 |
25 |
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Non metal burr |
100 um |
50 um |
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Ball land to via hole (um) |
100 x 100 um |
75 x 75 um |
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